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Applicant:
Indian Institute of Technology (IIT) Patna 
Title:
A stepped microchannel heat sink for cooling an electronic device 
Inventor(s):
Mr. Sumit Raj, Mr. Anurag Shukla, Dr. Manabendra Pathak, Dr. Mohd. Kaleem Khan 
Applicant:
Indian Institute of Technology (IIT) Patna 
Application type:
Applied - 2019-01-07 
Application Number:
201931000706 
Applied at:
India 
Entered by:
Indian Institute of Technology (IIT) Patna 
Abstract:
The present invention discloses a heat sink comprising a heat sink member having a top and a bottom, said top having a plurality of microchannels extending along a length of said member, each said microchannel having a first wall opposite to a second wall, progressively recesses from said top, formed by a combination of at least one step at each said walls and a converging portion, configured to increase surface area and passively reduce bubble clogging by allowing a vapor slug, formed in said converging portion to expand and relax in said at least one step, when thermally coupled to interact with a coolant fluid. 

 
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