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Applicant:
Indian Institute of Technology (IIT) Patna 
Author:
Verma, A. and S. Hait,  
Corresponding Authors:
S. Hait 
DOI #:
https://doi.org/10.1016/j.psep.2018.10.005 
Title:
Chelating extraction of metals from e-waste using diethylenetriamine pentaacetic acid,  
Journal:
Process Safety and Environmental Protection  
Year:
2019 
Volume:
121 
Page:
1–11, 
Keywords:
E-waste, Printed circuit board, Metals, Chemical leaching, Chelation, DTPA 
Abstract:
In this study, the chelating extraction of base metals namely, Cu, Zn, Ni from printed circuit board (PCB)of obsolete computer was carried out using diethylene triamine pentaacetic acid (DTPA) as a safer ligand.At a liquid to solid ratio (L/S ratio) of 50 and the comminuted PCB in the size range of 0.038–1 mm,the maximum extraction of around 97% Cu at 4.5 d and more than 99% each of Zn and Ni at 3 d wasachieved using 0.5 M DTPA at pH of 9, temperature of 50◦C and mixing speed of 450 rpm. Using 0.9 MH2O2under optimized process conditions, around 99% Cu and 82% Ni leaching were achieved in 8 halong with complete leaching of Zn in 1 h only. Kinetics development using the shrinking core model(SCM) indicated that the metal extraction from the PCB comminution fines using DTPA is controlled bydiffusion process. Further, metal recovery of around 98% each for Cu and Ni and 95% for Zn was achievedby the chemical precipitation of the leachate. Chelating extraction using DTPA coupled with the chemicalprecipitation of the leachate has the potential to emerge as a complete solution for metal recycling frome-waste. 
Entered by:
Physics Head on 2020-08-03 
 
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