Equipment Info

Wire Thermionic Bonder

Equipment Info

Equipment Code : 3226690

Make : TPT Wire Bonder GmbH

Model : TPT -HB05

Institution : Indian Institute of Technology (IIT) Palakkad

Department : Central Instrumentation Facility

Funding Agency Details : Ministry of Education

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : The Equipment has the capability to Manual Wedge Wire Bonder with adjustable height (60mm) with Heater stage (250 degree Celsius). It has the ability to bond using Aluminium (Al) or Gold (Au) wires> The equipment can be used for bonding the devices with the measurement pad

Usage Rate: (as indicated by the custodian/host institution)

S.No.	Users Category	Rate (unit ) & (In Rupees)
1	Academic (External)*
2	Academic (Internal)***
3	Grassroot innovator
4	Industry User
5	National Research Lab User
6	Startup/MSME User

Accessories / Consumables / Spare parts / Testing modes

Sample Name	Sample Type	Sample UOM	Sample Availability	Unit Cost	Sample Quantity	Sample Description
No Data Available

The Indian Science, Technology, and Engineering facilities Map (I-STEM) is an interactive web portal designed to accelerate scientific progress in India. This initiative, conceived and supported by the Office of the Principal Scientific Adviser to the Government of India, creates a centralized platform for sharing publicly funded R&D equipment and facilities across various institutions throughout the country.

Resources

18004253281 (customer care)
support@istem.co.in

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

Wire Thermionic Bonder

Equipment Info

Equipment Code : 3226690

Make : TPT Wire Bonder GmbH

Model : TPT -HB05

Institution : Indian Institute of Technology (IIT) Palakkad

Department : Central Instrumentation Facility

Funding Agency Details : Ministry of Education

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : The Equipment has the capability to Manual Wedge Wire Bonder with adjustable height (60mm) with Heater stage (250 degree Celsius). It has the ability to bond using Aluminium (Al) or Gold (Au) wires> The equipment can be used for bonding the devices with the measurement pad

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Resources

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

Wire Thermionic Bonder

Equipment Info

Equipment Code : 3226690

Make : TPT Wire Bonder GmbH

Model : TPT -HB05

Institution : Indian Institute of Technology (IIT) Palakkad

Department : Central Instrumentation Facility

Funding Agency Details : Ministry of Education

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : The Equipment has the capability to Manual Wedge Wire Bonder with adjustable height (60mm) with Heater stage (250 degree Celsius). It has the ability to bond using Aluminium (Al) or Gold (Au) wires> The equipment can be used for bonding the devices with the measurement pad

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Acknowledgement Statement For Equipment users:

Acknowledgement Statement For Equipment users:

Resources