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Equipment Info

RF DC Magnetron Sputtering Unit

Equipment Info

Equipment Code : 826740

Make : Advanced Process Technology (APT) India

Model :

Institution : Malaviya National Institute of Technology (MNIT) Jaipur

Department : Material Research Center

Funding Agency Details : Ministry of Education

Pooling of Equipment slot :   No

AMC End Date (Valid Till) :  

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : RF/DC magnetron sputtering unit (APT) can coat thin films of metals, semiconductors and oxides capable of producing vacuum up to 5x10-6Torr. The system has two magnetron cathodes (size of each sputtering target is 2 inches) with possibility of both RF and DC operations. Rotatable substrate holder is capable of holding substrates of sizes from one cm to one inch diameter and substrate heating up to 800 ?C . The system has two mass flow controllers, one for argon and the other for nitrogen / oxygen. Reactive sputtering can also be done.

Usage Rate: (as indicated by the custodian/host institution)


Samples External Academic User Internal Academic User Industry User Start-ups National Research Lab User Grassroot innovator
RF Sputtering
Sputtering Target (ZnO,TiO2) up to 200nm)
Sputtering Target (Al, Zn, Cu) up to 200nm

Accessories / Consumables / Spare parts / Testing modes

Sample Name Sample Type Sample UOM Sample Availability Unit Cost Sample Quantity Sample Description
No Data Available

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