Equipment Info

Die Bonding System

Equipment Info

Equipment Code : 529628

Make : Excel Instruments, INDIA

Model :

Institution : Indian Institute of Technology (IIT) Roorkee

Department : TIDES Incubation Centre

Funding Agency Details : 0

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Die bonder is use to attach a die (or chip) to a substrate, package, or another die. This die bonder machines enable two connect the dies to other chips or substrate

Usage Rate: (as indicated by the custodian/host institution)

Samples	External Academic User	Internal Academic User	Industry User	Start-ups	National Research Lab User	Grassroot innovator
Default Analysis

Accessories / Consumables / Spare parts / Testing modes

Sample Name	Sample Type	Sample UOM	Sample Availability	Unit Cost	Sample Quantity	Sample Description
No Data Available

The Indian Science, Technology, and Engineering facilities Map (I-STEM) is an interactive web portal designed to accelerate scientific progress in India. This initiative, conceived and supported by the Office of the Principal Scientific Adviser to the Government of India, creates a centralized platform for sharing publicly funded R&D equipment and facilities across various institutions throughout the country.

Resources

18004253281 (customer care)
support@istem.co.in

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

Die Bonding System

Equipment Info

Equipment Code : 529628

Make : Excel Instruments, INDIA

Model :

Institution : Indian Institute of Technology (IIT) Roorkee

Department : TIDES Incubation Centre

Funding Agency Details : 0

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Die bonder is use to attach a die (or chip) to a substrate, package, or another die. This die bonder machines enable two connect the dies to other chips or substrate

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Resources

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

Die Bonding System

Equipment Info

Equipment Code : 529628

Make : Excel Instruments, INDIA

Model :

Institution : Indian Institute of Technology (IIT) Roorkee

Department : TIDES Incubation Centre

Funding Agency Details : 0

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Die bonder is use to attach a die (or chip) to a substrate, package, or another die. This die bonder machines enable two connect the dies to other chips or substrate

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Acknowledgement Statement For Equipment users:

Acknowledgement Statement For Equipment users:

Resources