Equipment Info

Semi-Automatic Wire Bonder

Equipment Info

Equipment Code : 3646181

Make : MCUBE Technologies Pvt. Ltd., Pune (Maharashtra)

Model : HB10

Institution : National Institute of Technology (NIT) Warangal

Department : Central Research Instrumentation Facility

Funding Agency Details : Institution Funding (Self Supported)

Pooling of Equipment slot :   No

AMC End Date (Valid Till) :  

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Application :Semi-automatic wire bonders are essential tools in microelectronics manufacturing, used to create reliable electrical connections between chips and their packages using fine wires (typically gold or aluminum) applications like semiconductor packaging, aerospace and Automotiv

Usage Rate: (as indicated by the custodian/host institution)


Samples External Academic User Internal Academic User Industry User Start-ups National Research Lab User Grassroot innovator
< 10 bonds (Note 1: Type of Bonds that can be made: Wedge - Wedge Wedge- Ball Ball - Ball Note 2: Bonding Material: Gold, Aluminium)
>10 and < 20 bonds (Note 1: Type of Bonds that can be made: Wedge - Wedge Wedge- Ball Ball - Ball Note 2: Bonding Material: Gold, Aluminium)
>20 and < 30 bonds (Note 1: Type of Bonds that can be made: Wedge - Wedge Wedge- Ball Ball - Ball Note 2: Bonding Material: Gold, Aluminium)
>30 and < 40 bonds (Note 1: Type of Bonds that can be made: Wedge - Wedge Wedge- Ball Ball - Ball Note 2: Bonding Material: Gold, Aluminium)
>40 and < 50 bonds (Note 1: Type of Bonds that can be made: Wedge - Wedge Wedge- Ball Ball - Ball Note 2: Bonding Material: Gold, Aluminium)

Accessories / Consumables / Spare parts / Testing modes

Sample Name Sample Type Sample UOM Sample Availability Unit Cost Sample Quantity Sample Description
No Data Available