Equipment Info

SEMI AUTOMATIC WIRE BONDER

Equipment Info

Equipment Code : 1947225

Make : TPT WIRE BONDER GMBH

Model : HB 16

Institution : Indian Institute of Technology (IIT) Kharagpur

Department :

Funding Agency Details : MeitY, Govt. of India

Pooling of Equipment slot :   No

AMC End Date (Valid Till) :  

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : The TPT HB 16 is a semiautomatic wire bonding system designed for precision interconnection of semiconductor devices. It supports various bonding techniques, including wedge bonding and ball bonding, and is suitable for research and development, prototyping, and small-scale production. Key Features: Bonding Techniques: Supports wedge and ball bonding methods. Wire Compatibility: Accommodates gold and aluminum wires of various diameters. Substrate Handling: Compatible with a range of substrates, including PCBs, ceramic packages, and semiconductor dies. User Interface: Equipped with an intuitive control system for easy operation and parameter adjustment. Microscope Integration: Includes a high-magnification microscope for precise alignment and inspection.

Usage Rate: (as indicated by the custodian/host institution)

S.No. Users Category Rate (unit ) & (In Rupees)
1 Academic (External)*
2 Academic (Internal)***
3 Grassroot innovator
4 Industry User
5 National Research Lab User
6 Startup/MSME User


Accessories / Consumables / Spare parts / Testing modes

Sample Name Sample Type Sample UOM Sample Availability Unit Cost Sample Quantity Sample Description
No Data Available