Equipment Info

RF-DC Sputter-Thermal-E Beam Deposition Unit

Equipment Info

Equipment Code : 858609

Make : HHV Advanced Technologies Pvt. Ltd.

Model : Customized

Institution : SATHI Foundation BITS Pilani

Department : SATHI Foundation-BITS Pilani

Funding Agency Details : DST, Govt. of India, BITS Pilani

Pooling of Equipment slot : Yes

AMC End Date (Valid Till) :

1 / 1

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PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Enables high-uniformity deposition of metal, oxide, and nitride thin films using DC and RF sputtering, along with e-beam and thermal evaporation for high-purity thin film formation.

Usage Rate: (as indicated by the custodian/host institution)

Samples	External Academic User	Internal Academic User	Industry User	Start-ups	National Research Lab User	Grassroot innovator
Deposition upto 400 nm
Deposition of Au, Ag, Pt for 400 nm
Deposition above 400 nm
Deposition of Ag, Au, Pt for above 400 nm

Accessories / Consumables / Spare parts / Testing modes

Sample Name	Sample Type	Sample UOM	Sample Availability	Unit Cost	Sample Quantity	Sample Description
No Data Available

The Indian Science, Technology, and Engineering facilities Map (I-STEM) is an interactive web portal designed to accelerate scientific progress in India. This initiative, conceived and supported by the Office of the Principal Scientific Adviser to the Government of India, creates a centralized platform for sharing publicly funded R&D equipment and facilities across various institutions throughout the country.

Resources

18004253281 (customer care)
support@istem.co.in

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

RF-DC Sputter-Thermal-E Beam Deposition Unit

Equipment Info

Equipment Code : 858609

Make : HHV Advanced Technologies Pvt. Ltd.

Model : Customized

Institution : SATHI Foundation BITS Pilani

Department : SATHI Foundation-BITS Pilani

Funding Agency Details : DST, Govt. of India, BITS Pilani

Pooling of Equipment slot : Yes

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Enables high-uniformity deposition of metal, oxide, and nitride thin films using DC and RF sputtering, along with e-beam and thermal evaporation for high-purity thin film formation.

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Resources

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

RF-DC Sputter-Thermal-E Beam Deposition Unit

Equipment Info

Equipment Code : 858609

Make : HHV Advanced Technologies Pvt. Ltd.

Model : Customized

Institution : SATHI Foundation BITS Pilani

Department : SATHI Foundation-BITS Pilani

Funding Agency Details : DST, Govt. of India, BITS Pilani

Pooling of Equipment slot : Yes

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : Enables high-uniformity deposition of metal, oxide, and nitride thin films using DC and RF sputtering, along with e-beam and thermal evaporation for high-purity thin film formation.

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Acknowledgement Statement For Equipment users:

Acknowledgement Statement For Equipment users:

Resources