Equipment Info

Wire Bonder

Equipment Info

Equipment Code : 2360050

Make : MCUBE Technologies

Model : TPT HB02

Institution : National Institute of Technical Teachers Training and Research (NITTTR) Bhopal

Department : Department of Electrical and Electronics Engineering Education

Funding Agency Details : NITTTR Bhopal

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

1 / 1

❮ ❯

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : • Manual Ultrasonic Wedge wire bonder • Gold wire diameter – 17 µm to75 µm (0.7-3mil) • Aluminium wire diameter - 17-75µm (0.7-3mil) • Bond force – 5 to 200 cN • Bond time: 0 – 20000 msec • Temperature controller – up to 250°C +/- 1°C

Usage Rate: (as indicated by the custodian/host institution)

S.No.	Users Category	Rate (unit hour) & (In Rupees)
1	Academic (External)*
2	Academic (Internal)***
3	Grassroot innovator
4	Industry User
5	National Research Lab User
6	Startup/MSME User

Accessories / Consumables / Spare parts / Testing modes

Sample Name	Sample Type	Sample UOM	Sample Availability	Unit Cost	Sample Quantity	Sample Description
No Data Available

The Indian Science, Technology, and Engineering facilities Map (I-STEM) is an interactive web portal designed to accelerate scientific progress in India. This initiative, conceived and supported by the Office of the Principal Scientific Adviser to the Government of India, creates a centralized platform for sharing publicly funded R&D equipment and facilities across various institutions throughout the country.

Resources

18004253281 (customer care)
support@istem.co.in

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

Wire Bonder

Equipment Info

Equipment Code : 2360050

Make : MCUBE Technologies

Model : TPT HB02

Institution : National Institute of Technical Teachers Training and Research (NITTTR) Bhopal

Department : Department of Electrical and Electronics Engineering Education

Funding Agency Details : NITTTR Bhopal

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : • Manual Ultrasonic Wedge wire bonder • Gold wire diameter – 17 µm to75 µm (0.7-3mil) • Aluminium wire diameter - 17-75µm (0.7-3mil) • Bond force – 5 to 200 cN • Bond time: 0 – 20000 msec • Temperature controller – up to 250°C +/- 1°C

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Resources

Indian Science Technology and Engineering facilities Map

Indian Science Technology and Engineering facilities Map

Wire Bonder

Equipment Info

Equipment Code : 2360050

Make : MCUBE Technologies

Model : TPT HB02

Institution : National Institute of Technical Teachers Training and Research (NITTTR) Bhopal

Department : Department of Electrical and Electronics Engineering Education

Funding Agency Details : NITTTR Bhopal

Pooling of Equipment slot : No

AMC End Date (Valid Till) :

PRISM Service Category (About PRISM) : D

Pre-Experiment Support (including sample preparation, setup assistance and pre-experimental guidance) :

Post-Experiment Support (including result interpretation, data analysis and post-experimental reporting) :

Equipment Certification (if any) (No document available):

Equipment Calibration (if any) (No document available):

Remarks / Special Instructions (if any):

Description : • Manual Ultrasonic Wedge wire bonder • Gold wire diameter – 17 µm to75 µm (0.7-3mil) • Aluminium wire diameter - 17-75µm (0.7-3mil) • Bond force – 5 to 200 cN • Bond time: 0 – 20000 msec • Temperature controller – up to 250°C +/- 1°C

Usage Rate: (as indicated by the custodian/host institution)

Accessories / Consumables / Spare parts / Testing modes

Acknowledgement Statement For Equipment users:

Acknowledgement Statement For Equipment users:

Resources